Taiwan's Powertech Technology announced plans to begin production at the world's first panel-level chip packaging facility for artificial intelligence (AI) chips as early as 2027. The new facility, located in Hsinchu, Taiwan, will focus on packaging server central processing units, AI computing chips, and advanced optics.

The company is investing approximately $2.2 billion in this initiative, positioning itself ahead of competitors like TSMC in adopting next-generation packaging technology for AI chips. Major semiconductor companies AMD and Broadcom are likely to be among the first customers to utilize Powertech's new packaging capabilities.

This development marks a significant step in Taiwan's semiconductor industry, reinforcing its role in advancing AI chip manufacturing technologies.

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